Wafer and chip inspection / measurement
For you we find customized solutions for non-contact optical inspection of wafers, probe cards, dies and microchip components. For this purpose, we offer systems for layer thickness measurement, contact inspection, electrical characterization, probe head positioning, sample manipulation and metrology of wafer microstructures in the nanometer range.
Individual customization and development of your Innovaiton
- Optimal positioning solution for your application with a fast and free 3D design
- Design of functional samples, prototypes up to series production
- Integrated development of your mechanics, electronics and software
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Series production of your innovation on > 3.900 m² production area
more about the technical specifications
Cleanroom systems up to Class 2
On more than 100 m2 of cleanroom space, we exclusively manufacture high-precision and particle-free state-of-the-art technology for cleanroom systems up to ISO 14644-1 Class 2.
More on series developmentVacuum standard axes up to 10-12
Our high-precision modular vacuum stages for linear, lifting, rotary and XYZ positioning have proven themselves over decades. They withstand the most extreme life tests with 24/7 operation.
Go to Vacuum Standard axesIndividual life cycle tests
We implement your life cycle tests for you at our numerous universal test stands for various individual test scenarios in our measurement laboratories.
More about test and measurement